Hot melt adhesive is a type of adhesive that is sensitive to temperature and melts into a liquid upon heating, but will solidify again after cooling at natural room temperature. Some people may question whether hot melt adhesive particles are prone to detachment in extremely low temperature environments? In fact, sometimes encountering such detachment may just happen to be due to low ambient temperature, but it is easy to overlook the negative effects of other factors and cause different situations of hot melt adhesive detachment, so it may not necessarily be related to low temperature.

However, if the ambient temperature is really low, it can also easily cause degumming! Because both the hot melt adhesive particles and the adhesive block have a certain tolerance to temperature, and both have a maximum value that can withstand low temperatures, the premise of low temperature causing degumming is that the temperature really exceeds the minimum temperature peak that the adhesive particles can withstand!

The specifications of hot melt adhesives produced by different manufacturers vary due to different application conditions, and there are requirements for low temperature resistance. Simply put, when the ambient temperature drops below the maximum low-temperature resistance of the hot melt adhesive, there is a possibility of the adhesive layer falling off at the bonding position. The worse the environmental climate, the higher the risk value!

Of course, besides the impact of low temperature environment, other factors that can make the bonding position of hot melt adhesive unstable cannot be ruled out, and the combined effect of temperature becomes even more complex. The decrease in temperature is only intuitively perceived by our human body, while other factors such as excessive dust and weak antioxidant properties of colloids are relatively difficult to pay attention to and often overlooked. And low temperature is naturally considered the main cause of detachment.

In fact, hot melt adhesive particles may not fall off at low temperatures, but this possibility cannot be ruled out, even if used in very low temperature environments. The formula of hot melt adhesive particles can also be adjusted to improve its low temperature resistance, making it less prone to delamination even at temperatures below minus ten degrees Celsius.

At present, the research and development technology of hot melt adhesives is very mature and is constantly developing performance that is suitable for a wider range of applications. Therefore, whether it is in the humid climate in the south or the dry and cold climate in the north, there are now many industries involved in the use of hot melt adhesives. Therefore, the low-temperature resistance of hot melt adhesive particles is still very good and trustworthy.

   2023-5-22